Title:
POLYMERIC MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP2710276
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a polymeric molding material having the properties of the former two of the following constituent polymers and being excellent in impact resistance and elongation by mixing a polyamide with a polycarbonate and a specified modified ternary block polymer as a compatibilizer for the former two polymers.
SOLUTION: This molding material comprises about 5-95wt.%, based on the total of components (i) and (ii), polyamide (i), about 95-5wt.%, based on the total of components (i) and (ii), polycarbonate (ii) and about 1-30wt.%, based on the total of components (i) and (ii), product obtained by grafting maleic anhydride onto a ternary block copolymer represented by the formula: S1-EB-S2 (wherein S1 and S2 are each a polystyrene block; and EB is an ethylene/butylene copolymer block).
Inventors:
Shin Horiuchi
Takeshi Kitano
Choi
Lee Yuge
Takeshi Kitano
Choi
Lee Yuge
Application Number:
JP28116095A
Publication Date:
February 10, 1998
Filing Date:
October 30, 1995
Export Citation:
Assignee:
Director of Industrial Technology
International Classes:
C08J5/00; C08F285/00; C08F287/00; C08L51/06; C08L53/00; C08L69/00; C08L77/00; (IPC1-7): C08L69/00; C08F287/00; C08J5/00; C08L51/06; C08L53/00; C08L77/00
Domestic Patent References:
| JP748487A | ||||
| JP6271740A | ||||
| JP2500984A |
Attorney, Agent or Firm:
Director, Institute of Materials Technology, Institute of Industrial Technology
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