Title:
表面に伝導性を付与する、イオンビーム又はイオン注入処理のためのポリマー樹脂
Document Type and Number:
Japanese Patent JP2004519549
Kind Code:
A
Abstract:
The present invention relates to a resin composition suitable for an ion beam, ion plasma or ion implanation treatment. The resin is consists of one or more components selected from polyphenylene oxide, polycarbonate, polybuthylene terephthalate, polysulfone, polyethylene terephthalate, polyethersulfone, polyphenylenesulfide, polystyrene, acrylonitrile-butadiene-styrene copolymer, polyetherimide, polyamide, polymethylmethacrylate, polyacetal, polyethylene, polyropylene, styrene-butadiene rubber, ethylene-propylene rubber and EPDM rubber. So this resin having a proper conductivity is very useful for a packing material of cellular phone, computer monitor, liquid crystal display, and a IC film or tube.
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Inventors:
Kim, Gwang-Sop
Application Number:
JP2002579938A
Publication Date:
July 02, 2004
Filing Date:
September 27, 2001
Export Citation:
Assignee:
GE Polymer Land Company, Limited
International Classes:
C08J7/00; C08K3/00; C08K7/04; C08L67/02; C08L69/00; C08L71/00; C08L71/12; C08L81/06; C08L101/00; H01L23/00; H05K9/00; (IPC1-7): C08L101/00; C08J7/00; C08K3/00; C08K7/04; H01L23/00
Attorney, Agent or Firm:
Takaho Kawawa