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Title:
POLYMERIZABLE COMPOSITION, RESIN MOLDING AND LAMINATE
Document Type and Number:
Japanese Patent JP2013076015
Kind Code:
A
Abstract:

To provide a polymerizable composition useful for producing a laminate having extremely small dielectric loss tangent in high frequency region, excellent in heat resistance and peel strength, and small in warpage; a resin molding obtained using the polymerizable composition; and a laminate formed by laminating the resin molding.

This polymerizable composition includes a cycloolefin monomer, a polymerization catalyst, a crosslinking agent, a crosslinking auxiliary agent and a reactive fluidizer, where the cycloolefin monomer contains a cycloolefin monomer having a (meth)acryloyl group and a cycloolefin monomer not having the (meth)acryloyl group in a weight ratio (cycloolefin monomer having a (meth)acryloyl group: cycloolefin monomer not having the (meth)acryloyl group) within a range of 1:99 to 30:70; and the reactive fluidizer has 1-20 pts.wt. monofunctional compound having one vinylidene group and 0.1-20 pts.wt. difunctional compound having two vinylidene groups each based on 100 pts.wt. of the cycloolefin monomer.


Inventors:
Hoshino, Manabu
Application Number:
JP2011000217466
Publication Date:
April 25, 2013
Filing Date:
September 30, 2011
Export Citation:
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Assignee:
NIPPON ZEON CO LTD
International Classes:
C08F283/14; C08F8/00; C08F232/00; C08G61/08; C08J5/24
Attorney, Agent or Firm:
大石 治仁