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Title:
POLYMERIZABLE COMPOUND, POLYMERIZABLE COMPOSITION, POLYMER AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2012012495
Kind Code:
A
Abstract:

To provide a polymerizable compound having high durability and capable of forming a coated film without damaging electric characteristics, and capable of providing a new organic semiconductor material, to provide a polymerizable composition containing the polymerizable compound and a polymerization initiator, to provide a polymer obtained by polymerizing the polymerizable compound or the polymerizable composition, and to provide a semiconductor device using the polymer as a constituent material.

The polymerizable compound is represented by formula (I) [wherein, X1 and X2 are each O or the like; A1 and A2 are each a specific aromatic group; Y1 to Y6 are each -O-C(=O)- or the like; and Z1 and Z2 are each 2-10C alkenyl or the like]. The polymerizable composition contains the polymerizable compound and the polymerization initiator. The polymer is obtained by polymerizing the polymerizable compound or the polymerizable composition. The semiconductor device uses the polymer as the constituent material.


Inventors:
SAKAMOTO KEI
KIRIKI TOMOJI
Application Number:
JP2010150472A
Publication Date:
January 19, 2012
Filing Date:
June 30, 2010
Export Citation:
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Assignee:
NIPPON ZEON CO
International Classes:
C08F22/20; C07D493/06
Domestic Patent References:
JPS49125349A1974-11-30
JP2006245178A2006-09-14
JP2006316011A2006-11-24
JP2009029746A2009-02-12
JP2010006794A2010-01-14
JPS49125349A1974-11-30
JP2006245178A2006-09-14
JP2006316011A2006-11-24
JP2009029746A2009-02-12
JP2010006794A2010-01-14
Attorney, Agent or Firm:
Haruhito Oishi