To provide a polymerizable compound sufficiently improving the adhesion between the smooth surface of a metallic layer and a resin layer.
The polymerizable compound is represented by formula (I-1) [wherein X is oxygen, sulfur or a group represented by -NH- and a plurality of Xs may be the same or different; Z1 is a group represented by formula (Z-11) or (Z-12); Z2 is a 1-20C alkyl group which may have a substituent, an alkenyl group, an alkynyl group, an aromatic group which may have a substituent or Z1 and a plurality of Z2s may be the same or different, provided that the case of the plurality of Z2s being all Z1s is excluded; when Z1 is plural, the plurality of Z1s may be the same or different; and A1 is an arylene group which may have a substituent].
TOGI SHINSUKE
DAN KEIKA
EBARA UDYLITE KK
JP2007517875A | 2007-07-05 | |||
JP2007517875A | 2007-07-05 |
JPN6014000826; J. Polym. Sci. Part A: Polymer Chem. 26, 1988, 1405-1418
JPN6014000828; Eur. Polym. J. 25, 1989, 455-460
Masatake Shiga
Suzuki Mitsuyoshi
Mitsunaga Igarashi
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