Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYMERIZABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2017160372
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polymerizable resin composition which has high sensitivity to light having a wavelength of 400 nm or more, and has small dissociation between a width of a mask to be used and a width of a pattern to be obtained when the pattern is formed.SOLUTION: A polymerizable resin composition contains a resin (A), a polymerizable compound (B), a polymerization initiator (C), a polymerization initiation assistant (C-1) and a solvent (D). The resin (A) is a resin containing a structural unit derived from a compound having an alicyclic epoxy group or an oxetanyl group and an unsaturated bond. The polymerization initiation assistant (C-1) is a compound represented by formula (V-1) or formula (V-2).SELECTED DRAWING: None

Inventors:
KAWANISHI YU
MIMA SHOJI
Application Number:
JP2016047985A
Publication Date:
September 14, 2017
Filing Date:
March 11, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08F2/44; C09D4/00; C09D7/12; C09D163/00; C09D171/00; G02F1/1333; G03F7/004; G03F7/029; G03F7/031; G03F7/033; H01L51/50
Domestic Patent References:
JP2009139932A2009-06-25
JP2010107755A2010-05-13
JP2016029489A2016-03-03
JP2015127381A2015-07-09
JP2015199815A2015-11-12
JP2014159412A2014-09-04
JP2004163923A2004-06-10
Foreign References:
CN1501167A2004-06-02
Attorney, Agent or Firm:
Toru Nakayama
Toru Sakamoto