Title:
ポリオレフィン系樹脂フィルム及びポリオレフィン系樹脂フィルム用組成物
Document Type and Number:
Japanese Patent JP5318307
Kind Code:
B2
Abstract:
To provide a polyolefin based resin film of high elastic modulus and a composition for producing a polyolefin based resin film of high elastic modulus. The polyolefin based resin film is characterized in that a polyolefin ÄAÜ having a weight average molecular chain length of 2850 nm or more and a polyolefin wax ÄBÜ having a weight average molecular weight of 700 to 6000 have been compounded in a ratio of ÄAÜ/ÄBÜ = 90/10 to 50/50 (by weight) as the resin component, and 10 to 300 parts by weight of inorganic fillers have been added to 100 parts by weight of the resin component.
Inventors:
Atsuhiro Takada
Kuruma Ryuma
Akira Hanada
Takeshi Yamada
Kuruma Ryuma
Akira Hanada
Takeshi Yamada
Application Number:
JP2001100230A
Publication Date:
October 16, 2013
Filing Date:
March 30, 2001
Export Citation:
Assignee:
Sumitomo Chemical Co., Ltd.
International Classes:
C08L23/02; C08J5/18; C08K3/00
Domestic Patent References:
| JP6262679A |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office