Title:
ポリオキシメチレン成形材料
Document Type and Number:
Japanese Patent JP4340286
Kind Code:
B2
Abstract:
Thermoplastic molding compositions, comprising A) from 15 to 99.94% by weight of a polyoxymethylene homo- or copolymer B) from 0.05 to 10% by weight of a nonpolar polypropylene wax, C) from 0.01 to 5% by weight of at least one ester or amide of saturated or unsaturated aliphatic carboxylic acids having from 10 to 40 carbon atoms with saturated aliphatic alcohols or amines having from 2 to 40 carbon atoms, D) from 0 to 80% by weight of other additives, where the total of the percentages by weight of components A) to D) is always 100%.
Inventors:
Wolfgang Sauerler
Johannes Heinemann
Johannes Heinemann
Application Number:
JP2006505252A
Publication Date:
October 07, 2009
Filing Date:
April 24, 2004
Export Citation:
Assignee:
BASF SE
International Classes:
C08L59/00; C08K5/10; C08K5/20; C08L23/12; C08L59/02; C08L59/04; D01F6/66; D01F6/94
Domestic Patent References:
| JP2001081281A | ||||
| JP2001142176A | ||||
| JP2002072539A | ||||
| JP2002519466A |
Foreign References:
| WO2004058875A1 | ||||
| WO2004058884A1 |
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
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