Title:
POLYOXYMETHYLENE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2003147161
Kind Code:
A
Abstract:
To provide a polyoxymethylene resin composition having high thermal stability, good moldability and excellent in an appearance with little foreign matters.
The polyoxymethylene resin composition is obtained by blending (A) 100 pts.wt. of a polyoxymethylene resin with (B) 0.01-10 pts.wt. of a heat stabilizer having a glycoluril structure, wherein the heat stabilizer comprises a reaction product of formaldehyde with a compound having a glycoluril structure and/or a derivative of the reaction product.
Inventors:
TOGAWA MITSUNARI
NISHIMURA TORU
KARASAWA HIROO
NISHIMURA TORU
KARASAWA HIROO
Application Number:
JP2001348775A
Publication Date:
May 21, 2003
Filing Date:
November 14, 2001
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L59/00; C08K5/3445; (IPC1-7): C08L59/00; C08K5/3445