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Title:
POLYPHENOL, EPOXY RESIN, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JPH09104731
Kind Code:
A
Abstract:

To obtain an epoxy resin composition improved in heat resistance, toughness and mechanical strengths by mixing an epoxy resin with a specified polyphenol.

One (1)mol of a compound of formula I (wherein P is H or a 1-4C alkyl; and X is hydroxyl or an alkoxyl) is reacted with 3-60mol of a phenol at 20-200°C for 1-30hr in the presence of an acid catalyst to obtain a polyphenol (A) of formula II (wherein R is H, a halogen, a 1-8C alkyl, an aryl or an alkenyl. A solution of a mixture of 1 equivalent (in terms of the hydroxyl groups) of the polyphenol with 1-20mol of an epihalohydrin is reacted with 0.8-1.5mol, per mol (in terms of the hydroxyl groups of the polyphenol) of an alkali metal hydroxide at 20-120°C for 1-10hr to obtain an epoxy resin (B) of formula III (wherein G is glycidyl). Component A or B is mixed with 0.7-1.2 equivalents, per equivalent (in terms of the epoxy groups) of component B, of a curing agent, 0.1-0.5 pt.wt., per 100 pts.wt. epoxy resin, cure accelerator and 0-90wt.% inorganic filler.


Inventors:
AKATSUKA YASUMASA
KUBOKI KENICHI
HASEGAWA RYOICHI
Application Number:
JP28819595A
Publication Date:
April 22, 1997
Filing Date:
October 11, 1995
Export Citation:
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Assignee:
NIPPON KAYAKU KK
International Classes:
C08L63/00; C08G8/04; C08G59/06; C08G59/62; (IPC1-7): C08G8/04; C08G59/06; C08G59/62; C08L63/00