Title:
POLYPHENYLENE ETHER-CONTAINING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2020200427
Kind Code:
A
Abstract:
To provide a polyphenylene ether-containing resin composition which is excellent in heat resistance of a cured product and to provide an electronic circuit substrate material, a resin film, a prepreg and a laminate formed using the same.SOLUTION: There is provided a resin composition which comprises: (a) a polyphenylene ether component having a structure represented by the following formula (1): (wherein, X, a, R5, k, Y, n, A and L are as defined in the specification) and a number average molecular weight of 500 to 8000, (b) a crosslinking agent containing an aromatic compound having two carbon-carbon unsaturated double bonds in one molecule and (c) an organic peroxide.SELECTED DRAWING: Figure 1
Inventors:
OSADA KAZUTO
NAKAMURA SHOU
ENDO MASAO
NAKAMURA SHOU
ENDO MASAO
Application Number:
JP2019110319A
Publication Date:
December 17, 2020
Filing Date:
June 13, 2019
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
C08F299/02; B32B15/08; C08G65/48; C08J5/24; H05K1/03
Domestic Patent References:
| JP2007308685A | 2007-11-29 | |||
| JP2019023263A | 2019-02-14 |
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima
Naohisa Akashi
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima
Naohisa Akashi