ポリフェニレンエーテル含有樹脂組成物

Japanese Patent JP7202920

B2

An object of the present invention is to provide a resin composition containing polyphenylene ether, which is excellent in electrical characteristics, and also provides an electronic circuit board material, a resin film, a prepreg and a laminate formed by using the resin composition containing polyphenylene ether. The resin composition of the present invention includes: (a) polyphenylene ether component having a structure expressed by the following formula (1), and a number average molecular weight of 500 to 8,000, wherein X, a, R5, k, Y, n, A and L in the formula are as defined in the specification; (b) a cross-linking agent; and (c) an organic peroxide.

WO/2005/030846	POLYMER NETWORKS
JP7446025	High oxygen permeability silicone hydrogel composition, contact lens manufactured from high oxygen permeability silicone hydrogel composition, and manufacturing method thereof
JP2002220425	RESIN COMPOSITION, SOLDER RESIST RESIN COMPOSITION AND THEIR CURED ITEMS

Masao Endo
Nagata alone

JP2019028391A

January 12, 2023

February 20, 2019

Click for automatic bibliography generation  

ASAHI KASEI KABUSHIKI KAISHA

C08F290/06; B32B15/08; B32B17/04; C08F220/30; C08F299/02; C08J5/24; C08K5/3477; C08L9/00; C08L25/06; C08L53/02; C08L71/00; H05K1/03

JP2007308685A
JP2018168347A

WO2005073264A1
US20080171817
US9051465
US20160102174

Aoki Atsushi
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma

Previous Patent: PRINTER CONTROL SYSTEM, PRINT SYSTEM AND PRINT DATA CREATE METHOD

Next Patent: Seeding machine