Title:
ポリフェニレンエーテル樹脂組成物、硬化物、ドライフィルム、フィルム、プリプレグ、金属張積層板、プリント配線基板および電子機器
Document Type and Number:
Japanese Patent JP6803181
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyphenylene ether resin composition which makes it possible to obtain a cured product that satisfies dielectric properties in a high frequency region suitable for a printed wiring board while having excellent heat resistance and heat stability.SOLUTION: A polyphenylene ether resin composition comprises polyphenylene ether (A), and a cyclic olefin (co) polymer (B). The ratio between a content of the polyphenylene ether (A) to a content of the cyclic olefin (co) polymer (B) in the polyphenylene ether resin composition, ((A)/(B)), is more than 5 and 50 or less.SELECTED DRAWING: None
Inventors:
Hirohiko Murase
Atsushi Morita
Takashi Oikawa
Junji Saito
Atsushi Morita
Takashi Oikawa
Junji Saito
Application Number:
JP2016169350A
Publication Date:
December 23, 2020
Filing Date:
August 31, 2016
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08L71/12; C08J5/18; C08J5/24; C08L45/00; C08L51/00
Domestic Patent References:
| JP63277274A | ||||
| JP2005306920A | ||||
| JP5186682A | ||||
| JP8143728A | ||||
| JP3207756A |
Attorney, Agent or Firm:
Shinji Hayami