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Title:
POLYPHENYLENE SULFIDE RESIN COMPOSITION WITH HIGH HEAT DISSIPATION FOR PRECISION MOLDING USE
Document Type and Number:
Japanese Patent JP2003231811
Kind Code:
A
Abstract:

To provide an optical parts precision molding compound consisting of a polyphenylene sulfide resin composition having good molding processability such as injection molding and also having high heat dissipation.

This polyphenylene sulfide resin composition for optical parts precision molding use is obtained by incorporating (a) 100 pts.wt. of a polyphenylene sulfide resin with (b) 50-300 pts.wt. of graphite 1-300 μm in mean particle size and (c) 20-300 pts.wt. of another inorganic filler, with the proviso that the total amount of components (b) and (c) is ≤400 pts.wt.


Inventors:
TSURUSAKI MUNEO
Application Number:
JP2002032930A
Publication Date:
August 19, 2003
Filing Date:
February 08, 2002
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
G02B1/04; C08K3/00; C08K3/04; C08L81/02; (IPC1-7): C08L81/02; C08K3/00; C08K3/04; G02B1/04