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Patent Searching and Data


Title:
POLYPHENYLENE SULFIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3168714
Kind Code:
B2
Abstract:

PURPOSE: To obtain the resin composition improved in adhesion to epoxy resin by mixing a polyphenylene sulfide resin with a specified aromatic sulfone compound and a fibrous or non-fibrous filler.
CONSTITUTION: This resin composition is obtained by mixing 100 pts.wt. polyphenylene sulfide resin (a polymer comprising at least 70mol% desirably at least 90mol% repeating unit of formula I, and optionally below 30mol%, based on all the repeating units, repeating units of structural formulas II, III, etc.) with 0.1-20 pts.wt. aromatic sulfone compound of formula IV (wherein R and R' are each a 6-22C hydrocarbon group; and A and A' are each an aromatic group) and 20-400 pts.wt. fibrous and/or nonfibrous fillers. This composition is improved in adhesion to epoxy resin with substantial detriment to the inherent mechanical strengths.


Inventors:
Atsushi Sekioh
Kosuke Sakamoto
Kazuhiko Kobayashi
Application Number:
JP21169292A
Publication Date:
May 21, 2001
Filing Date:
August 07, 1992
Export Citation:
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Assignee:
Toray Industries, Inc.
International Classes:
C08K3/00; C08K5/42; C08K7/02; C08L81/02; (IPC1-7): C08L81/02; C08K3/00; C08K5/42; C08K7/02