Title:
POLYPHENYLENE SULFIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3637715
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain the subject composition improved in moldability, processability and solder heat resistance, comprising a specific compound, a crystalline polymide resin, a prescribed metal salt and a fibrous filler.
SOLUTION: This polyphenylene sulfide resin is obtained by compounding 100 pts.wt. of a blend of (A) 70-95wt.% of a polyphenylene sulfide having 10-50,000 poise melt viscosity and (B) 30-5wt.% of a crystalline polymide resin, preferably a polyamide 6, a polyamide 46 or a polymide 66 with (C) 0.05-5 pts.wt. of (i) a fatty acid metal salt having ≥280°C decomposition temperature, preferably a metal stearate or a metal montanate or (ii) a metal diarylphosphate of the formula (R1 a H or a 1-4C alkyl; R2 and R3 are each a 1-9C alkyl; M is an alkali metal) and (D) 25-100 pts.wt. of a fibrous filler as a reinforcing material.
Inventors:
Ueda Masaharu
Tomohiro Ishikawa
Tomohiro Ishikawa
Application Number:
JP1535997A
Publication Date:
April 13, 2005
Filing Date:
January 29, 1997
Export Citation:
Assignee:
Tosoh Corporation
International Classes:
C08K5/09; C08K5/521; C08K7/04; C08L81/02; (IPC1-7): C08L81/02; C08K5/09; C08K5/521; C08K7/04
Domestic Patent References:
| JP4255757A | ||||
| JP5325612A | ||||
| JP3064358A | ||||
| JP58067752A | ||||
| JP5078575A | ||||
| JP7228772A |