Title:
POLYPROPYLENE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0243242
Kind Code:
A
Abstract:
PURPOSE:To reduce the diameter of dispersed particles of a rubber component in a formed resin compsn. and to improve heat sealing strength, low-temp. impact resistance and transparency by compounding the specified rubber component in a polypropylene resin. CONSTITUTION:The title polypropylene resin is formed of 50-99wt.% polypropylene resin (A) and 1-50wt.% rubber component (B). As this rubber component, a random copolymer compsn. wherein the following random copolymer (i) and (ii) are incorporated with a wt. ratio in the range of 95:5-20:80 is used. An ethylene random copolymer (i) is one selected from random copolymers of ethylene with a 3-20C alpha-olefin having an ethylene content of 60-95mol% and an MFR (at 230 deg.C) of 0.1-50g/10min and a propylene random copolymer (ii) is one selected from random copolymers of propylene with a 2-20C alpha-olefin except propylene having a propylene content of 60-95mol% and an MFR (at 230 deg.C) of 0.1-50g/10min.
Inventors:
TANAKA MUTSUHIRO
SUGI MASAHIRO
SUGI MASAHIRO
Application Number:
JP19505888A
Publication Date:
February 13, 1990
Filing Date:
August 04, 1988
Export Citation:
Assignee:
MITSUI PETROCHEMICAL IND
International Classes:
C08J5/18; C08L23/00; C08L23/10; C08L23/08; C08L23/12; C08L23/14; C08L23/16; C08L23/18; C08L53/00; (IPC1-7): C08L23/08; C08L23/10; C08L23/14
Attorney, Agent or Firm:
Shigeru Yanagihara
Next Patent: POLYOLEFIN COMPOSITION