Title:
POLYSTYRENE-BASED RESIN COMPOSITION AND ITS MOLDING
Document Type and Number:
Japanese Patent JP3516364
Kind Code:
B2
Abstract:
PURPOSE: To obtain a polystyrene-based resin composition, containing a specific compound in a specified styrene-based polymer composition without causing damage by copper, excellent in thermal aging and water resistances, electrical characteristics, toughness and rigidity and useful as electrical and electronic materials, etc.
CONSTITUTION: This polystyrene-based resin composition contains (B) 0.005-5.0 pts.wt. compound such as N,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxy- hydrocinnamamide and, as necessary, further (C) 0.005-5.0 pts.wt. compound of the formula (R is methyl or t-butyl; n is 1-4; X is a residue after removing n OH groups of an alcohol having 1-4 OH groups) in (A) 100 pts.wt. composition comprising (A1) 1-99wt.% polystyrene-based resin having the syndiotactic structure, (A2) 1-99wt.% polyamide resin, 0.1-10wt.% compatibilizing agent having the compatibility with the component (A1) and groups reactive with the component (A2) and 0-50wt.% rubber-like elastomer (modified material).
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Inventors:
Masuyama, Akitoshi
Fukui, Hiroki
Okada, Akihiko
Fukui, Hiroki
Okada, Akihiko
Application Number:
JP12772595A
Publication Date:
April 05, 2004
Filing Date:
May 26, 1995
Export Citation:
Assignee:
IDEMITSU PETROCHEM CO LTD
International Classes:
C08K3/00; C08K5/10; C08K5/13; C08K5/17; C08K5/20; C08K5/24; C08L25/04; C08L73/00; C08L77/00; C08L101/00; (IPC1-7): C08L25/04; C08K3/00; C08K5/13; C08K5/20; C08K5/24; C08L77/00; C08L101/00
Attorney, Agent or Firm:
大谷 保
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