Title:
POLYSTYRENE-BASED RESIN PARTICLE, FOAMABLE RESIN PARTICLE, METHODS FOR PRODUCING THEM, FOAM PARTICLE AND MOLDED FOAM
Document Type and Number:
Japanese Patent JP2013159683
Kind Code:
A
Abstract:
To provide polystyrene-based resin particles which can provide a molded foam with excellent bending elastic modulus and compression elastic modulus.
In polystyrene-based resin particles, the ratio (Mw1/Mw2) of the weight average molecular weight Mw1 of a surface part to the overall weight average molecular weight Mw2 is 1.05-2.0, as measured by GPC method, and the ratio (Mz1/Mz2) of the Z average molecular weight Mz1 of the surface part to the overall Z average molecular weight Mz2 is 1.05-1.5.
Inventors:
ARAMOMI YUKIO
Application Number:
JP2012021956A
Publication Date:
August 19, 2013
Filing Date:
February 03, 2012
Export Citation:
Assignee:
SEKISUI PLASTICS
International Classes:
C08J9/18; C08J9/228
Domestic Patent References:
| JP2008201989A | 2008-09-04 | |||
| JP2004137448A | 2004-05-13 | |||
| JP2003277541A | 2003-10-02 | |||
| JP2004131722A | 2004-04-30 |
Attorney, Agent or Firm:
Shintaro Nogawa
Shinji Kai
Yusuke Kaneko
Kiyoshi Inamoto
Shinji Kai
Yusuke Kaneko
Kiyoshi Inamoto