Title:
POLYURETHANE MATERIAL FOR USE AT LOW TEMPERATURE
Document Type and Number:
Japanese Patent JP3814709
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a polyurethane material having a low coefficient of linear expansion and improved heat insulation properties in a low-temperature region by reacting a specified diol compound with a diisocyanate compound.
SOLUTION: A diol compound of formula I (wherein A1 and A2 are each H or methyl) is reacted with a diisocyanate compound at 60-200°C, desirably, 70-160°C for 1-24 hr, desirably, 2-12 hr in the presence or absence of a solvent to obtain a polyurethane comprising repeating units of formula II (wherein X is a divalent organic group) and having a coefficient of linear expansion (25 to -250°C) of 1.0×10-4°C-1 or below, desirably, 9.0×10-5°C-1 or below and having, when measured by gel permeation chromatography using a polystyrene as the standard substance, a weight-average molecular weight of 5,000-300,000, desirably, 10,000-250,000, a number-average molecular weight of 2,500-300,000, desirably, 10,000-250,000. After the addition of a blowing agent, this polyurethane is foamed to obtain a foamed polyurethane having a thermal conductivity at -170°C of 0.018-0.0010 W/mK, desirably, 0.017-0.011 W/mK.
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Inventors:
Masahiro Yamada
Mitsuaki Yamada
Mitsuaki Yamada
Application Number:
JP16017998A
Publication Date:
August 30, 2006
Filing Date:
June 09, 1998
Export Citation:
Assignee:
OSAKA GAS CO.,LTD.
International Classes:
C08G18/32; (IPC1-7): C08G18/32
Domestic Patent References:
| JP11279252A | ||||
| JP11279251A | ||||
| JP11158245A | ||||
| JP11255859A | ||||
| JP11209454A | ||||
| JP8003260A |
Attorney, Agent or Firm:
Eiji Saegusa
Kakehi Yuro
Takeshi Ohara
Hiroji Nakagawa
Yasumitsu Tate
Kenji Saito
Jun Fujii
Hitoshi Seki
Mutsuko Nakano
Shinsuke Otsuki
Suzuki Katsuto
Kakehi Yuro
Takeshi Ohara
Hiroji Nakagawa
Yasumitsu Tate
Kenji Saito
Jun Fujii
Hitoshi Seki
Mutsuko Nakano
Shinsuke Otsuki
Suzuki Katsuto