Title:
膜モジュールのシール材用ポリウレタン樹脂形成性組成物
Document Type and Number:
Japanese Patent JP5802330
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide polyurethane resin forming compositions which are for use in sealing a membrane module and exhibit excellent curability and castability and low turbidity and which can ensure excellent flatness of a cut section when used as a sealing material for a membrane module and which can form a polyurethane resin that is less susceptible to elution. The present invention provides two polyurethane resin forming compositions which are for use in sealing a membrane module, namely, a polyurethane resin forming composition which comprises a chief material that contains (A) an organic polyisocyanate component and a curing agent that contains (B) a polyol component and which is characterized in that the chief material and/or the curing agent contains (C) a bicyclic amidinium salt represented by general formula (1), and a polyurethane resin forming composition which is characterized by comprising a chief material that comprises (A) an organic polyisocyanate component, a curing agent that comprises (B) a polyol component, and (C) a bicyclic amidinium salt represented by general formula (1).
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Inventors:
Sumitomo Yuko
Tetsuya Shimada
Tetsuya Shimada
Application Number:
JP2014507647A
Publication Date:
October 28, 2015
Filing Date:
March 13, 2013
Export Citation:
Assignee:
SANYO CHEMICAL INDUSTRIES,LTD.
International Classes:
B01D63/00; A61M1/18; B01D63/02; C02F1/44; C08G18/20
Domestic Patent References:
JP2007332257A | 2007-12-27 | |||
JPS5893716A | 1983-06-03 | |||
JPS6420287A | 1989-01-24 | |||
JP2002187927A | 2002-07-05 | |||
JP2007332257A | 2007-12-27 |
Foreign References:
WO2009104700A1 | 2009-08-27 | |||
WO2009104700A1 | 2009-08-27 |
Attorney, Agent or Firm:
Atomi International Patent Office