Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
多価ヒドロキシ樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
Document Type and Number:
Japanese Patent JP7193337
Kind Code:
B2
Abstract:
To provide an epoxy resin, a polyhydric hydroxy resin, and a composition thereof, which can provide a cured material having an excellent dielectric property and also having an excellent low water absorption property and low thermal expansion property, and which are suitable for use as an insulation material, a coating, an adhesive, and the like in the electric and electronic fields.SOLUTION: Provided is a polyhydric hydroxy resin obtained by reacting an intermediate resin and an aromatic hydroxy compound, the intermediate resin having a double bond in its structure and being obtained by subjecting a styrenic compound represented by the following general formula (1) and formaldehydes to a Prins reaction under an acidic condition. (Here, R1 represents a hydrogen atom or a C1-6 hydrocarbon group.) Further, there are provided: an epoxy resin obtained by reacting the polyhydric hydroxy resin and epichlorohydrin; and an epoxy resin composition comprising the above polyhydric hydroxy resin or the epoxy resin as an essential component.SELECTED DRAWING: None

Inventors:
Yano Hiroyuki
Sulesta Niranshiyan
Naofumi Yamada
Kaji Masafumi
Application Number:
JP2018244514A
Publication Date:
December 20, 2022
Filing Date:
December 27, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Nippon Steel Chemical & Material Co., Ltd.
International Classes:
C08G61/02; C08G8/08; C08G59/06; C08G59/62
Domestic Patent References:
JP62181359A
JP63086767A
JP8165328A
Attorney, Agent or Firm:
Kazuya Sasaki
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Naruse Katsuo



 
Previous Patent: 削孔装置

Next Patent: NONMONOLITHIC LASER ARRAY