Title:
接触抵抗の小さい多孔質チタン
Document Type and Number:
Japanese Patent JP5125435
Kind Code:
B2
Abstract:
Porous titanium having a low contact resistance includes porous titanium body, Au, and a Ti oxide layer (3). Porous titanium includes continuous holes (1) opening on a surface and being connected to inner holes and a skeleton (2). Au adheres to at least an outer skeletal surface (4) of the porous titanium via diffusion bonding to form a network structure. The Ti oxide layer (3) is formed in a clearance between adjacent Au codes (5) of the Au network sticking. The width of an Au code (5) of the Au network is 0.3 to 10 µm at least at one position; and the thickness of the Ti oxide layer (3), which is formed in the clearance between adjacent Au codes (5) of the Au network is 30 to 150 nm.
Inventors:
Kenji Orido
Toshiharu Hayashi
Masahiro Wada
Izumi Reiko
Koji Hoshino
Toshiharu Hayashi
Masahiro Wada
Izumi Reiko
Koji Hoshino
Application Number:
JP2007292956A
Publication Date:
January 23, 2013
Filing Date:
November 12, 2007
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
C23C28/00; C01G23/047; C23C8/12; C23C10/20; C23C12/00; H01M4/86; H01M8/10
Domestic Patent References:
| JP2007107091A | ||||
| JP2004211190A | ||||
| JP2004134276A | ||||
| JP2001006713A |
Attorney, Agent or Firm:
Kazuo Tomita
Kageyama Shuichi
Kageyama Shuichi