Title:
携帯型情報処理装置
Document Type and Number:
Japanese Patent JP4110779
Kind Code:
B2
Abstract:
A back enclosure has a stepped portion disposed perpendicularly to one side of a rectangular flat portion. The stepped portion is extended from the one side to a side opposite to it and virtually parallel to a flow of a molten material. With the described configurations, the enclosure can be reduced in thickness without lowering its strength and, in addition, can be manufactured without impairing moldability of the molten metal in the course of the manufacture of it by metal molding. Thus with such a back enclosure, a portable information processor being lighter and yet having a higher withstanding strength against external forces can be provided.
More Like This:
Inventors:
Isao Shimada
Akira Iwamoto
Akira Iwamoto
Application Number:
JP2002001995A
Publication Date:
July 02, 2008
Filing Date:
January 09, 2002
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B22D21/04; H05K5/04; B22C9/08; B22C9/22; B22D25/02; G06F1/16
Domestic Patent References:
| JP8054961A | ||||
| JP8063258A | ||||
| JP2001334356A | ||||
| JP2000183572A | ||||
| JP7246450A |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano