Title:
POSITION MEASURING METHOD, POSITION MEASURING DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2020041859
Kind Code:
A
Abstract:
To provide a position measuring method with which it is possible to reduce the area of a dicing line.SOLUTION: According to an embodiment, the position measuring method includes an alignment measurement step and an overlay measurement step. In the alignment measurement step, first and second layers are arranged by being laminated on a substrate, and a first mark 210 provided on the first layer to be processed which is coated with a resist on top of the second layer and having had a plurality of segment parts 261 arranged at a pitch less than a resolution limit relative to light in wavelength of λ1 is irradiated with the light in wavelength of λ1, and alignment measurement in an exposure process is carried out. In the overlay measurement step, a second mark 310 formed by exposure to the first mark and the resist and a development process and having had a plurality of segment parts 361 arranged at said pitch is irradiated with light in wavelength of λ2 shorter than the wavelength λ1, and an overlay measurement is carried out.SELECTED DRAWING: Figure 2
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Inventors:
TOJIMA MIKI
YAMANE OSAMU
OKAMOTO YOSUKE
YAMANE OSAMU
OKAMOTO YOSUKE
Application Number:
JP2018168209A
Publication Date:
March 19, 2020
Filing Date:
September 07, 2018
Export Citation:
Assignee:
KIOXIA CORP
International Classes:
G01B11/00; G03F7/20; G03F9/00; H01L21/68
Attorney, Agent or Firm:
Sakai International Patent Office