Title:
POSITIONER WITH PLATING STAGE AND PEELING STAGE
Document Type and Number:
Japanese Patent JP3546747
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus, capable of partly peeling plating films of Au, Ag, etc., off within areas which are not required for plating, except the required areas for plating on lead frames connected in series at a specified pitch as in a tape and allowing the positions therefor to be easily adjusted.
SOLUTION: This apparatus comprises a plating stage 6, having a partly plating plate 3, a holder 4, and pins 5 for fixing a lead frame 1 to a prescribed plating position, and a peeling stage 11 having a partly peeling plate 7, a holder 8, pins 9 for fixing the lead frame 1 to a prescribed peeling position, feed screw movable along the carrying direction of the lead frame 1 and a slide for moving the peeling plate 7 synchronously with the feed screw 10.
Inventors:
Kazuo Maetani
Takashi Kobayashi
Takashi Kobayashi
Application Number:
JP8209499A
Publication Date:
July 28, 2004
Filing Date:
March 25, 1999
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
H01L23/50; C25D5/02; C25D5/48; C25D7/12; C25D17/08; (IPC1-7): H01L23/50; C25D5/02
Domestic Patent References:
| JP63277784A | ||||
| JP55079893A | ||||
| JP9324290A | ||||
| JP7050376A | ||||
| JP3230824A | ||||
| JP1013151U |
Attorney, Agent or Firm:
Yasushi Shinohara
Masayuki Fujinaka
Masayuki Fujinaka