POSITIONING DEVICE FOR ELECTRONIC COMPONENT WITH LEAD

Title:

POSITIONING DEVICE FOR ELECTRONIC COMPONENT WITH LEAD

Document Type and Number:

Japanese Patent JPH1168279

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To easily and accurately position an electronic component with lead mounted on a printed board. SOLUTION: A stopper 20 integrally molded with a chassis 5 is projectingly provided, so as to be positioned near an electronic component 1 with the lead mounted on the printed board 2 and the planting state of the electronic component 1 with the lead is corrected by a stopper 20. Thus, when the electronic component 1 with the lead mounted on the printed board 2 incorporated to the chassis 5 is tilted, the electronic component 1 with the lead is pulled up and abutted to the stopper 20. Just from the abutting work, the planting state of the electronic component 1 with the lead is corrected precisely.

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Inventors:

HIROTA SATORU

Application Number:

JP22861797A

Publication Date:

March 09, 1999

Filing Date:

August 25, 1997

Export Citation:

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Assignee:

AIWA CO

International Classes:

H05K1/18; H05K7/14; H05K3/30; (IPC1-7): H05K1/18; H05K7/14

Attorney, Agent or Firm:

Kunio Yamaguchi (1 person outside)

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