Title:
POSITIONING AND INSTALLATION METHOD OF IC
Document Type and Number:
Japanese Patent JPH05343827
Kind Code:
A
Abstract:
PURPOSE: To simply and accurately position and mount an IC (SOP, QFP or the like) of high pin counts type and to surely dissipate heat.
CONSTITUTION: The positioning and mounting method of an IC includes followings: a component (an IC 3 covered with a molding resin 6) which is provider with a positioning part is mounted on one face of board 1; a heat- dissipating means (a radiating fin 2) is installed on the other face of the board 1; and a proper part on the component 3 is connected to the heat-dissipating means 2 by using heat-conductive connection means (screws 10) so as to be passed through the board.
Inventors:
TAKAHASHI SHINJI
WAKIHARA YOSHINORI
WAKIHARA YOSHINORI
Application Number:
JP16830692A
Publication Date:
December 24, 1993
Filing Date:
June 04, 1992
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K1/18; H05K7/20; H05K1/02; H05K3/32; (IPC1-7): H05K1/18; H05K7/20
Attorney, Agent or Firm:
Mitsuhiro Kamijo (1 outside)