PURPOSE: To eliminate the damage of a semiconductor device by providing elasticity in upward and downward directions, inserting a guide pin having a taper at its end into the reference hole of the device, bringing an attracting pad made of an elastic material into contact with the rear face of the device, and evacuating it in vacuum.

CONSTITUTION: The diameter of the body of a guide pin 9 is formed larger than that of the reference hole 3 of a semiconductor device 1 to bring the hole 3 into contact with the tapered part of the end of the pin 9 to be engaged therewith. Since the pin 9 has elasticity in upward and downward directions, an attracting pad 10 is brought into contact with the rear face of the device 1 and evacuated in vacuum to brought the hole 3 into contact with the tapered part of the end of the pin 9 to be engaged therewith, the device can be brought into close contact with its reference face 11, and can be positioned at the face 11 of the device 1. Thus, since the hole 3 of the device is brought into contact with the end of the pin 9 to be sufficiently engaged, it is not necessary to cut the wall of the hole 3, to generate dusts or to destroy the device 1.