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Title:
POSITIVE PHOTORESIST COMPOSITION
Document Type and Number:
Japanese Patent JP3936503
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a resist composition which retains satisfactory intrasurface uniformity even in a thin film process and reproduces the desired resist pattern with high sensitivity and high resolving power.
SOLUTION: The positive photoresist composition contains a resin having a velocity of dissolution in an alkali developing solution increased by the action of an acid, a compound which generates the acid when irradiated with active light or radiation and a solvent and has 2-7 cP viscosity at 25°C.


Inventors:
Moto Nakao
Kenichiro Sato
Kazuya Uenishi
Application Number:
JP32709199A
Publication Date:
June 27, 2007
Filing Date:
November 17, 1999
Export Citation:
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Assignee:
FUJIFILM Corporation
International Classes:
G03F7/039; H01L21/027; C08F220/06; C08F220/16; C08F220/28; C08F220/38; C08F222/06; C08F222/12; C08F222/40; C08F232/08; C08K5/00; C08L33/04; C08L35/00; C08L35/02; C08L45/00; (IPC1-7): G03F7/039; C08F220/06; C08F220/16; C08F220/28; C08F220/38; C08F222/06; C08F222/12; C08F222/40; C08F232/08; C08K5/00; C08L33/04; C08L35/00; C08L35/02; C08L45/00; H01L21/027
Domestic Patent References:
JP10223501A
JP9507304A
JP11231539A
JP10078658A
JP11265067A
JP2001192569A
JP2000275845A
JP2001109157A
JP10312060A
JP6011607A
JP7244376A
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Kiyozumi Yazawa