Title:
POSITIVE PHOTORESIST COMPOSITION
Document Type and Number:
Japanese Patent JPH08190195
Kind Code:
A
Abstract:
PURPOSE: To provide a positive photoresist composition superior in sensitivity and resolution and, especially, less in the dependency of its performance on film thickness, and superior in heat resistance.
CONSTITUTION: The positive photoresist composition comprises an alkali-soluble resin, and a photosensitive compound of a quinonediazidosulfonic acid ester of a polyhydroxyl compound having ≥3 benzene rings and ≥4 hydroxyl groups, and ≤2 hydroxyl groups in one of the benzene rings, and the pattern area of the triester fraction of the quinonediazidosulfonic acid ester of the ≥4-valent polyhydroxyl compound amounts to ≥50% of the total pattern areas in a high- speed liquid chromatography.
Inventors:
SATO KENICHIRO
KODAMA KUNIHIKO
SHIRAKAWA KOJI
KODAMA KUNIHIKO
SHIRAKAWA KOJI
Application Number:
JP279195A
Publication Date:
July 23, 1996
Filing Date:
January 11, 1995
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/022; H01L21/027; (IPC1-7): G03F7/022; H01L21/027
Attorney, Agent or Firm:
Tadashi Hagino (3 outside)
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