Title:
POSITIVE PHOTOSENSITIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2001183835
Kind Code:
A
Abstract:
To provide a photosensitive resin composition having high sensitivity, giving a high contrast pattern, capable of shortening a development time and excellent in the resolution, adhesiveness and pattern shape of a minute pattern.
The new positive type photosensitive resin composition contains (A) 100 pts.wt. polyamide containing repeating units of a specified formula, (B) 1-50 pts.wt. photosensitive quinonediazido compound and (C) 1-50 pts.wt. amidophenol compound of a specified formula as essential components.
Inventors:
SAKAMOTO MIYUKI
NISHIKAWA MASAHITO
NISHIKAWA MASAHITO
Application Number:
JP36700599A
Publication Date:
July 06, 2001
Filing Date:
December 24, 1999
Export Citation:
Assignee:
ASAHI KASEI CORP
CLARIANT JAPAN KK
CLARIANT JAPAN KK
International Classes:
H01L21/027; C08G73/10; C08K5/20; C08K5/42; C08K5/435; C08L79/08; G03F7/004; G03F7/022; G03F7/037; G03F7/039; (IPC1-7): G03F7/039; C08G73/10; C08K5/20; C08L79/08; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Yoshio Narai (3 others)