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Title:
POSITIVE PHOTOSENSITIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3865890
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a positive photosensitive compsn. which imparts satisfactory sensitivity and resolution at the time of using a light source of ≤220 nm for exposure and has satisfactory dry etching resistance, adhesion to a substrate and developability by using an acid decomposable resin having specified alicyclic groups.
SOLUTION: A photosensitive compsn. contains a compd. which generates an acid by irradiating active light beams or radiation and a resin having polycyclic alicyclic groups represented by formulae I-III, etc. and groups which are decomposed by the action of the acid and increase solubility in an alkali developer. In the formulae I-III, R is an H atom, a linear or branched alkyl group which may have a substituent, a cycloalkyl, alkenyl or acyl group, X is a single bond, a divalent alkylene, alkenylene or cycloalkylene group which may have an ether, ester, amido, urethane or ureido group and Me is a methyl group. It is preferable that the resin further has carboxyl groups.


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Inventors:
Toshiaki Aoi
Kenichiro Sato
Application Number:
JP26702497A
Publication Date:
January 10, 2007
Filing Date:
September 30, 1997
Export Citation:
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Assignee:
FUJIFILM Holdings Co., Ltd.
International Classes:
G03F7/004; G03F7/039; C08F20/10; C08F20/54; C08F22/40; C08F28/02; C08L27/00; C08L29/10; C08L33/14; C08L33/24; C08L35/00; C08L41/00; C08L101/00; C09D201/00; G03F7/033; H01L21/027; (IPC1-7): G03F7/039; C08L101/00; C09D201/00; G03F7/004; G03F7/004; G03F7/033; H01L21/027; //C08F20/10; C08F20/54; C08F22/40; C08F28/02; C08L27/00; C08L29/10; C08L33/14; C08L33/24; C08L35/00; C08L41/00
Domestic Patent References:
JP9120162A
JP8015865A
JP6236036A
JP8259626A
JP9221526A
JP8220774A
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Hagino Taira
Kiyotaka Sasaki
Toshio Fukasawa
Zenichi Soeda



 
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