To provide a positive photosensitive polyimide precursor composition capable of forming a resin film which has a low thermal expansion coefficient, thereby suffering less from lowering of adhesion to a base material or warping of the base material and being free from deterioration in electrical characteristics, resolution or the like.

The positive polyimide precursor composition is characterized by containing a polyimide precursor having a benzoazole skeleton in the main chain and having at least a portion of hydrogen atoms of a side chain carboxyl group substituted with photo-elimination groups. Since the positive photosensitive polyimide precursor composition has a low thermal expansion coefficient after polyimidation, the thermal expansion coefficient difference between a base material with a low thermal expansion coefficient such as a silicon wafer and a polyimide obtained by applying and thermally cyclizing the positive polyimide precursor composition on the base material can be small. In addition, since adhesion between the base material and the polyimide is good and warping can be suppressed while maintaining good developability and photosensitivity, there can be obtained a good pattern.