Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND USAGE OF THE SAME
Document Type and Number:
Japanese Patent JP2015161942
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition from which a pattern film excellent in low dielectric characteristics can be formed while having high sensitivity in a forming process of the pattern film as well as maintaining a high film residual rate, without leaving a development residue and without decreasing coating film properties such as transmittance for light and solvent resistance after high-temperature baking.SOLUTION: The photosensitive resin composition comprises: a copolymer having structural units derived from an itaconic acid diester monomer, an aromatic vinyl monomer and an α,β-unsaturated carboxylic acid monomer; an esterified product of a trifunctional phenolic compound and a quinonediazide compound; and a compound having two or more epoxy groups.
Inventors:
NITO YOSHITOKU
TAGUCHI HIROYUKI
KATO YUKIHIRO
TAKAHASHI SHUICHI
TAGUCHI HIROYUKI
KATO YUKIHIRO
TAKAHASHI SHUICHI
Application Number:
JP2014039254A
Publication Date:
September 07, 2015
Filing Date:
February 28, 2014
Export Citation:
Assignee:
NOF CORP
International Classes:
G03F7/023; C08F212/06; C08F222/14; G03F7/004
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi
Hayashi Ichiyoshi