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Patent Searching and Data


Title:
POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2005202205
Kind Code:
A
Abstract:

To provide a positive resist composition which exhibits satisfactory transmittance at the time of using an exposure light source of ≤200 nm, specifically F2 excimer laser light (157 nm) and is improved in surface roughness, development defects, scum and resolution, and to provide a pattern forming method using the same.

The positive resist composition contains (A) a resin which has a methacrylic acid-based repeating unit in which a methyl group substituted by a hydroxy group and a fluoroalkyl group bonds to an α-carbon atom and is decomposed by the action of an acid to increase solubility in an alkaline developer, and (B) a compound which generates an acid upon irradiation with an actinic ray or a radiation. The pattern forming method uses the same.


Inventors:
Kanda, Hiromi
Mizutani, Kazuyoshi
Application Number:
JP2004000009103
Publication Date:
July 28, 2005
Filing Date:
January 16, 2004
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F20/04; C08F20/26; C08F212/14; C08F214/18; C08F216/14; C08F220/24; C08F232/08; H01L21/027; (IPC1-7): G03F7/039; C08F20/04; C08F20/26; C08F212/14; C08F214/18; C08F216/14; C08F220/24; C08F232/08; H01L21/027
Attorney, Agent or Firm:
小栗 昌平
本多 弘徳
市川 利光
高松 猛
濱田 百合子