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Patent Searching and Data


Title:
POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP2005351942
Kind Code:
A
Abstract:

To provide a positive resist composition for forming a resist pattern superior in a shape and etching resistance, and to provide a resist pattern forming method.

The positive resist composition includes a resin (A) having an acid dissociative dissolution suppression group and increasing alkali solubility by action of an acid, and a compound (B) generating the acid by irradiation of radiant ray. The resin (A) is a mixture of a main chain cyclic polymer (A1) and a polymer (A2) comprising only a constitutional unit (a') derived from (meta)acrylic ester and/or (meta)acrylic acid.


Inventors:
Takeshita, Masaru
Matsumaru, Shogo
Hayashi, Ryotaro
Haneda, Hideo
Iwai, Takeshi
Application Number:
JP2004000169590
Publication Date:
December 22, 2005
Filing Date:
June 08, 2004
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/039; C08F232/00; H01L21/027; (IPC1-7): G03F7/039; C08F232/00; H01L21/027
Attorney, Agent or Firm:
棚井 澄雄
志賀 正武
青山 正和
鈴木 三義
柳井 則子