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Patent Searching and Data


Title:
POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD EMPLOYING IT
Document Type and Number:
Japanese Patent JP2006133712
Kind Code:
A
Abstract:

To provide a positive resist composition which is employed in manufacturing steps of semiconductors such as ICs and when manufacturing liquid crystals, circuit boards for thermal heads, and used in the lithographic steps of other photo applications, and which improves developing defect rates in normal exposure and suppresses degradation of the DOF (depth of focus) and the profile when applied to liquid immersed exposure, with improved hydrophilicity and gnerating less scum, and also provide a pattern forming method using this composition.

This is a positive resist composition containing (A) resin which has a monocyclic or multicyclic cycloparaffin structure and is decomposed by acid and becomes easier to dissolve in an alkali developer, (B) a compound which generates acid when irradiated with active light or radiation, and (F) special surfactant. This pattern forming method employs this positive resist composition.


Inventors:
Kanda, Hiromi
Nishiyama, Fumiyuki
Application Number:
JP2004000358699
Publication Date:
May 25, 2006
Filing Date:
December 10, 2004
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/004; C08F220/18; C08F232/00; G03F7/039; H01L21/027
Attorney, Agent or Firm:
小栗 昌平
本多 弘徳
市川 利光
高松 猛