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Patent Searching and Data


Title:
POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP2008015162
Kind Code:
A
Abstract:

To provide a positive resist composition capable of achieving excellent MEF and a resist pattern forming method.

The positive resist composition comprises a resin component A having acid-dissociable dissolution inhibiting groups and alkali solubility increased by the action of an acid and an acid generator component B which generates an acid upon exposure to light, wherein the resin component A comprises a resin A1 having a constitutional unit a1 derived from an acrylic ester having a linear tertiary alkyl ester type acid-dissociable dissolution inhibiting group and a resin A2 having a constitutional unit a1' derived from an acrylic ester having a circular tertiary alkyl ester type acid-dissociable dissolution inhibiting group and not having the constitutional unit a1, and the acid generator component B comprises an onium salt B1 having an anion represented by formula (I), wherein R4 represents a 3C alkyl group or a 3C fluoroalkyl group.


Inventors:
SHIMIZU HIROAKI
Application Number:
JP2006185653A
Publication Date:
January 24, 2008
Filing Date:
July 05, 2006
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/039; C08F220/10; C08F232/04; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Masakazu Aoyama
Suzuki Mitsuyoshi
Noriko Yanai