Title:
POSITIVE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2002265436
Kind Code:
A
Abstract:
To obtain both a compound which has a high light transmission at 220 nm, especially of ArF excimer laser beam at 193 nm and has high acid generation ratio and a chemical amplification type positive resist composition which has high sensitivity, high resolving power, excellent adhesivity to a substrate and profile and improved edge roughness of pattern.
This acid generator has a specific structure. This positive resist composition is characterized by comprising the acid generator and a resin which contains an alicyclic group and an acid decomposable group, is decomposed by an acid action and increases solubility in an alkali.
Inventors:
AOSO TOSHIAKI
KODAMA KUNIHIKO
KODAMA KUNIHIKO
Application Number:
JP2001065051A
Publication Date:
September 18, 2002
Filing Date:
March 08, 2001
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/004; C07C381/12; C07D333/46; C07D409/06; C08K5/36; C08L33/04; C08L101/02; G03F7/039; H01L21/027; (IPC1-7): C07C381/12; C07D333/46; C07D409/06; C08K5/36; C08L33/04; C08L101/02; G03F7/004; G03F7/039; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri (4 outside)