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Patent Searching and Data


Title:
POSITIVE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2003345018
Kind Code:
A
Abstract:

To provide a positive resist composition having a sufficient transmitting property at ≤160 nm wavelength, practically when a light source of F2 excimer laser light (at 157 nm) is used, and having high sensitivity, high resolution and an excellent coating property.

The positive resist composition contains (A) the following resin and (B) a compound which produces an acid by the effect of active rays or radiation. The resin (A) has at least one kind of repeating unit having a specified structure and at least one kind of repeating unit having at least one fluorine atom in a side chain and having a group which is decomposed by the effect of an acid, and increases its solubility with an alkali developer by the effect of an acid.


Inventors:
SASAKI TOMOYA
MIZUTANI KAZUYOSHI
KANNA SHINICHI
Application Number:
JP2002149405A
Publication Date:
December 03, 2003
Filing Date:
May 23, 2002
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F212/14; C08F216/14; C08F218/00; C08F220/24; C08F220/28; C08F232/08; H01L21/027; (IPC1-7): G03F7/039; C08F212/14; C08F216/14; C08F218/00; C08F220/24; C08F220/28; C08F232/08; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri (4 outside)