Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POSITIVE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2004004226
Kind Code:
A
Abstract:

To provide a positive resist composition which is suitably used for a light source for exposure of ≤160 nm, particularly, an F2 excimer laser beam (157 nm), and specifically to provide a positive resist composition which exhibits sufficient transmissibility when used for the light source of 157 nm and has little line edge roughness, development defect and scum.

The positive resist composition contains (A) a resin which has a specific repeating unit having a norbornene structure at its side chain and is increased in solubility in an alkaline developing solution by the effect of an acid and (B) a compound which generates an acid by irradiation with active light or radiation.


Inventors:
MIZUTANI KAZUYOSHI
KANNA SHINICHI
Application Number:
JP2002158821A
Publication Date:
January 08, 2004
Filing Date:
May 31, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F16/14; C08F20/10; C08F212/14; C08F214/00; C08F220/42; C08F232/08; H01L21/027; (IPC1-7): G03F7/039; C08F16/14; C08F20/10; C08F212/14; C08F214/00; C08F220/42; C08F232/08; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Kuriu