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Patent Searching and Data


Title:
POSITIVE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2004361473
Kind Code:
A
Abstract:

To provide a positive resist composition suitable for use under an exposure light source of ≤200 nm, particularly F2 excimer laser light (157 nm), and to specifically provide a positive resist composition which exhibits satisfactory transmittance when a light source of 157 nm is used and is excellent in various properties such as affinity for a developer and image forming property.

The positive resist composition contains (A) a resin having a fluorine-containing specified repeating unit and having solubility in an alkali developer increased by the action of an acid and (B) a compound which generates an acid upon irradiation with an actinic ray or radiation.


Inventors:
KANDA HIROMI
MIZUTANI KAZUYOSHI
Application Number:
JP2003156566A
Publication Date:
December 24, 2004
Filing Date:
June 02, 2003
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F216/14; C08F220/24; C08F232/00; G03F7/033; H01L21/027; (IPC1-7): G03F7/039; C08F216/14; C08F220/24; C08F232/00; G03F7/033; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada