Title:
POSITIVE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP3909829
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a positive resist composition having satisfactory transmittance at the time of using an exposure light source of ≤160 nm, concretely F2 excimer laser light (157 nm) and improved in line edge roughness and development defects.
SOLUTION: The positive resist composition comprises (A) a compound which generates an acid upon irradiation with an actinic ray or a radiation, (B) an organic fluoropolymer which has at least one structure selected from formulae (I)-(III) and whose solubility in an alkali developer is increased by the action of an acid and (C) a solvent.
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Inventors:
Kazuyoshi Mizutani
Shinichi Kanna
Tomoya Sasaki
Shinichi Kanna
Tomoya Sasaki
Application Number:
JP2002074305A
Publication Date:
April 25, 2007
Filing Date:
March 18, 2002
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/039; C08F232/00; H01L21/027; (IPC1-7): G03F7/039; C08F232/00; H01L21/027
Domestic Patent References:
JP2003107706A | ||||
JP2003177539A | ||||
JP2003192729A | ||||
JP2002201219A |
Foreign References:
WO2001063362A1 | ||||
WO2001037047A1 | ||||
WO2000067072A1 |
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Kiyozumi Yazawa
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Kiyozumi Yazawa
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