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Title:
POSITIVE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP3909829
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a positive resist composition having satisfactory transmittance at the time of using an exposure light source of ≤160 nm, concretely F2 excimer laser light (157 nm) and improved in line edge roughness and development defects.
SOLUTION: The positive resist composition comprises (A) a compound which generates an acid upon irradiation with an actinic ray or a radiation, (B) an organic fluoropolymer which has at least one structure selected from formulae (I)-(III) and whose solubility in an alkali developer is increased by the action of an acid and (C) a solvent.


Inventors:
Kazuyoshi Mizutani
Shinichi Kanna
Tomoya Sasaki
Application Number:
JP2002074305A
Publication Date:
April 25, 2007
Filing Date:
March 18, 2002
Export Citation:
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Assignee:
FUJIFILM Corporation
International Classes:
G03F7/039; C08F232/00; H01L21/027; (IPC1-7): G03F7/039; C08F232/00; H01L21/027
Domestic Patent References:
JP2003107706A
JP2003177539A
JP2003192729A
JP2002201219A
Foreign References:
WO2001063362A1
WO2001037047A1
WO2000067072A1
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Kiyozumi Yazawa