POSITIVE RESIST COMPOSITION - FUJIFILM Corporation

Title:

POSITIVE RESIST COMPOSITION

Document Type and Number:

Japanese Patent JP3955489

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a positive resist composition suitable for use under an exposure light source of ≤160 nm, particularly F2 excimer laser light (157 nm) and to concretely provide a positive resist composition having satisfactory transmittance when a light source of 157 nm is used and ensuring reduced line edge roughness and development defects.
SOLUTION: The positive resist composition comprises (A) a fluororesin which has a specified repeating unit and is decomposed by the action of an acid to increase solubility in an alkali developer, (B) a compound which generates an acid upon irradiation with an actinic ray or a radiation, (C) a solvent and (D) a compound having at least one carboxyl group.

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Inventors:

Kazuyoshi Mizutani
Shinichi Kanna

Application Number:

JP2002086459A

Publication Date:

August 08, 2007

Filing Date:

March 26, 2002

Export Citation:

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Assignee:

FUJIFILM Corporation

International Classes:

G03F7/039; C08F210/14; C08F212/14; C08F220/10; C08F220/22; C08F232/00; G03F7/004; H01L21/027; (IPC1-7): G03F7/039; C08F210/14; C08F212/14; C08F220/10; C08F220/22; C08F232/00; G03F7/004; H01L21/027

Domestic Patent References:

JP2001233917A
JP2002012623A
JP2002072484A
JP2001215709A
JP11338150A
JP2002072481A
JP7092679A

Attorney, Agent or Firm:

Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Kiyozumi Yazawa

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