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Title:
POSITIVE RESIST MATERIAL
Document Type and Number:
Japanese Patent JPS6180246
Kind Code:
A
Abstract:

PURPOSE: To prevent a negative inversion in an eye-fitting mark scanning part by applying the positive resist contg. a mixture of an alkaline soluble resin and a quinoediazide compd. or 2-methyl-pentene-1-sulfone to the material.

CONSTITUTION: A novolak resin containing e.g. O-(tertiarybutyl)phenol-O-cresol- formaldehyde is used as the alkaline soluble resin. For example, naphthoquinone (1,2)-diazide(2)-5-sulfone-P-methylphenol ester is used a the quinonediazide compd. The titled material is prepared from the mixture of the above described novolak resin and the above described azide compd. or the above described sulfone. The ratio of between an exposure (DP) in a formation of a positive pattern and an exposure (DN) in an occurrence of the negative inversion is ≥50 (DN/DP). As the above described positive resist is used to the titled material, the mark scanning part does not occur the negative inversion, and said positive resist may be stripped by the solvent.


Inventors:
TANIGAKI KATSUMI
IIDA YASUO
Application Number:
JP20323484A
Publication Date:
April 23, 1986
Filing Date:
September 28, 1984
Export Citation:
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Assignee:
NEC CORP
International Classes:
C08G8/08; C08G8/28; C08K5/42; G03C1/72; G03F7/20; G03C5/08; G03F7/023; G03F7/039; H01L21/027; (IPC1-7): G03C1/72; G03C5/08; G03F7/00; H01L21/30
Domestic Patent References:
JP39008184A
JPS49127615A1974-12-06
JPS5692536A1981-07-27
Attorney, Agent or Firm:
Shin Uchihara



 
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