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Title:
POSITIVE TYPE PHOTORESIST COATING SOLUTION
Document Type and Number:
Japanese Patent JP3488332
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To ensure superior suitability to coating, sensitivity, heat resistance, etc., to prevent the generation of residue on development and to increase the rate of a residual film by incorporating an alkali-soluble resin, a compd. having a quinonediazido group and an org. solvent which is a specified mixed solvent.
SOLUTION: This photoresist coating soln. contains an alkalisoluble resin, a compd. having a quinonediazido group and an org. solvent which is a mixed solvent contg. propylene glycol monopropyl ether and 2-heptanone, preferably a mixed solvent consisting of 10-60wt.% propylene glycol monopropyl ether and 40-90wt.% 2-heptanone. The alkali-soluble resin is, e.g. a condensation product of phenol and aldehyde. The compd. having a quinonediazido group is, e.g. a perfectly or partially esterified body of naphthoquinone-1,2-diazido-5- sulfonic acid and a polyhydroxy compd.


Inventors:
Hayato Ohno
Suguru Nakao
Naonobu Harada
Shinichi Hidesaka
Hidekatsu Kohara
Toshimasa Nakayama
Application Number:
JP4046196A
Publication Date:
January 19, 2004
Filing Date:
February 02, 1996
Export Citation:
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Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
C09D5/00; C09D11/00; C09D161/02; C09D161/04; G03F7/004; G03F7/022; G03F7/20; H01L21/027; (IPC1-7): G03F7/004; G03F7/022; H01L21/027
Domestic Patent References:
JP9160228A
JP8320556A
JP7325396A
JP62169163A
Attorney, Agent or Firm:
Heihachi Hattori