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Title:
POSITIVE TYPE PHOTORESIST COMPOSITION FOR EXPOSURE WITH FAR ULTRAVIOLET RAY
Document Type and Number:
Japanese Patent JP2000292925
Kind Code:
A
Abstract:

To prevent the occurrence of development defects and a scum by incorporating a compound which generates an acid when irradiated with active light or the like, a polymer having specified repeating units and a group which is decomposed by the action of the acid and a compound which is decomposed by the action of the acid to generate sulfonic acid.

The positive type photoresist composition contains a compound which generates an acid when irradiated with active light or the like, a polymer having repeating units of one of formulae Ia and Ib, repeating units of formula II and a group which is decomposed by the action of the acid and a compound which is decomposed by the action of the acid to generate sulfonic acid. In the formula Ia, R1 and R2 are each H, cyano, hydroxyl or the like, X is O, S, -NH- or the like and A is a single bond or a divalent combining group. In the formula Ib, Z2 is -O- or the like. In the formula II, R11 and R12 are each H, cyano, halogen or alkyl which may have a substituent and Z1 is an atomic group containing combined two carbon atoms (C-C) for forming an alicyclic structure which may have a substituent.


Inventors:
SATO KENICHIRO
KODAMA KUNIHIKO
AOSO TOSHIAKI
Application Number:
JP9537399A
Publication Date:
October 20, 2000
Filing Date:
April 01, 1999
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
H01L21/027; C08F220/40; C08F222/00; C08F222/06; C08F232/08; C08K5/00; C08K5/42; C08L35/00; C08L45/00; G03F7/004; G03F7/039; (IPC1-7): G03F7/039; C08F220/40; C08F222/00; C08F222/06; C08F232/08; C08K5/00; C08K5/42; C08L35/00; C08L45/00; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Tadashi Hagino (4 outside)