To prevent the occurrence of development defects and a scum by incorporating a compound which generates an acid when irradiated with active light or the like, a resin which contains specified repeating units and is decomposed by the action of the acid to increase its alkali solubility and a compound which is decomposed by the action of the acid to generate sulfonic acid.
The positive type photoresist composition contains a compound which generates an acid when irradiated with active light or radiation, a resin which contains one of repeating units of formulae I and II and is decomposed by the action of the acid to increase its alkali solubility and a compound which is decomposed by the action of the acid to generate sulfonic acid. In the formulae I and II, R1-R8 may be mutually the same or different and are each H, an alkyl which may have a substituent, cyclic hydrocarbon which may have a substituent, halogen, cyano or the like, X is a divalent bonding group selected from O, S, etc., A is a single bond or a divalent group obtained by combining groups selected from among alkylene, substituted alkylene, ether, etc., and R9 is an alkyl which may have a substituent or the like.
KODAMA KUNIHIKO
AOSO TOSHIAKI
