Title:
POSITIVE TYPE PHOTORESIST COMPOSITION FOR EXPOSURE WITH FAR ULTRAVIOLET RAY
Document Type and Number:
Japanese Patent JP2002202607
Kind Code:
A
Abstract:
To provide a positive type photoresist composition for exposure with far UV having improved exposure margin and defocus latitude in the resolution of a contact hole pattern.
The positive type photoresist composition contains a compound which generates a perfluoroalkanesulfonic acid when irradiated with active rays or radiation and a resin having a specified structure and a velocity of dissolution in an alkali developing solution increased by the action of the acid.
Inventors:
SATO KENICHIRO
Application Number:
JP2000402246A
Publication Date:
July 19, 2002
Filing Date:
December 28, 2000
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F220/00; C08F222/00; C08F232/00; C08K5/00; C08K5/16; C08K5/42; C08L33/00; C08L35/00; C08L45/00; G03F7/004; G03F7/033; H01L21/027; (IPC1-7): G03F7/039; C08F220/00; C08F222/00; C08F232/00; C08K5/00; C08K5/16; C08K5/42; C08L33/00; C08L35/00; C08L45/00; G03F7/004; G03F7/033; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri (4 outside)